This
research report studies the global thin
wafer market in detail by segmenting in on the basis of
technology, applications, and geographical markets. This
comprehensive research report analyzes the worldwide thin wafer
market to provide industry numbers on growth drivers and restraints,
emerging opportunities, possible threats, and future projections for
growth.
The
key highlights of this report are a value chain analysis, review of
recent industry landmarks and developments, and an analysis of future
trends. The report also comprises an analysis based on Porter’s
five forces model to ascertain the future bargaining power of buyers
and suppliers, the possibility of new entrants posing a threat, the
degree of competition, the use of substitutes and more.
This
report further features a comprehensive Company Profiles section
which includes an overview of leading companies in the thin wafer
market, their financial standing, recent developments, product
pipelines, and an analysis of their strengths, weaknesses,
opportunities, and threats.
Overview
of the global thin wafer market
In
an age where electronic device configurations have to be small in
size, low on cost but high on performance, the role of
thin/ultra-thin semiconductors cannot be disputed. Thin wafers are
poised to constitute about 50% of the overall semiconductors market
in the next two to three years. From their traditional thickness of
about 500ì, semiconductors are now available in ultra-thin variants
with a thickness of about 40 ìm.
Applications
such as Power Devices (IG BTs), RF Devices and LEDs, and Advanced
Packaging applications (TSV, interposers and Fan out WLP) call for
temporary bonding. The development of new techniques has helped in
weeding out many difficulties that were faced with traditional chip
production processes. This great works in favor of the temporary
bonding technology segment, which will likely witness a whopping
growth of over 500% between 2012 and 2018.
The
thin wafer market is comprised of players that cater to the
ever-evolving needs of wireless devices, memory disks, and consumer
electronics. Thin wafers help in reducing the thickness of packages,
especially when it comes to packaged dies for smartphones and cell
phones. Thinner wafers also efficiently aid thermal management in
electronic devices. All of these advantages will act as growth
propellers for the global thin wafers market.
At
the same time, this rapidly decreasing thickness of wafers will also
create new challenges for the thin wafer industry. For instance,
ultra-thin wafers are not only less stable, but are also susceptible
to cracking or being damaged under stress. The dies used for thin
wafers can break easily or warp during the grinding process. On the
brighter side, these challenges can be addressed via wafer support
systems that can mitigate these challenges to a great degree. The
development of wafer support systems is an emerging opportunity in
the thin wafer market.
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